This note focuses on CMOS
manufacturing. Topics covered includes: CMOS process technology, work in progress
tracking, CMOS calculations, process technology, long channel and short channel
MOSFET, isolation technologies, back-end processing and packaging.
audience of this note is undergraduate chemical engineering and electronics and
communication engineering students. The focus will be on the various modules
relevant for chip manufacturing. Topics covered includes: Lithography, Depostion
Techniques, Removal Techniques, FEOL, Diffusion, Ion Implantation, Oxidation, ,
process Integration, Testing, Yield, Tools and Techniques.
note provides an introduction to the theoretical background and
application of each major IC fabrication processes: eg. oxidation, doping,
depositions, photolithography and etching. The prerequisites are the students
need are an understanding of basic transistor and diode operation. Topics
covered includes: Clean Room Technology Silicon Wafer Production,
Thermal Oxidation, Lithography, Advanced Lithography, Etching , Diffusion
Processes and Ion Implantation, Thin Film Deposition, Packaging, Yields,
Processing Silicon Foundries, CMOS and Bipolar Process Integration in practice,
Photolithography: resists, coating and mask aligners, CVD epitaxy and Plasma
This book focuses on the latest development of devices and fabrication
processes in the field of extremely miniaturized electromechanical systems. The
book offers new knowledge and insight into design, fabrication, and packaging,
as well as solutions in these aspects for targeted applications, aiming to
support scientists, engineers and academic trainees who are engaged in relevant
This lecture note covers the
following topics: Conduction in Semiconductors, Classification of Conductors,
Conduction in Metals, Conduction in Intrinsic Semiconductors, The Junction
Diode, Diode Clipper Circuits, The MOSFET Bias Equation, Modeling the MOSFET
Body Effect, The Common-Source Amplifier, The MOSFET Differential Amplifier, The
Bipolar Junction Transistor, The BJT Differential Amplifier and the
Complimentary Common Collector Amplifier.
This note explains the following topics: history of
microelectronics, evolution of microelectronics, printed circuit boards, diodes,
transistors, and the various types of integrated circuits, typical packaging
levels presently used for microelectronic systems, typical interconnections used
in microelectronic systems, environmental considerations for microelectronics.
This note explains the following topics: fundamental circuit
concepts and analysis techniques, First and second order circuits, impulse and
frequency response, Op Amps, Diode and FET: Device and Circuits, Amplification,
Logic and Filter.